Helios 5 Laser PFIB System
- 公司名称 赛默飞世尔科技（中国）有限公司
- 品牌 FEI/赛默飞
- 型号
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- 更新时间 2025/1/20 16:33:49
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欲了解更多信息，请浏览公司网站：www.thermofisher.com 赛默飞世尔科技中国简介赛默飞世尔科技进入中国发展已超过35年，在中国的总部设于上海，并在北京、广州、香港、成都、沈阳、西安、南京、武汉、昆明等地设立了分公司，员工人数约为5000名。我们的产品主要包括分析仪器、实验室设备、试剂、耗材和软件等，提供实验室综合解决方案，为各行各业的客户服务。为了满足中国市场的需求，现有7家工厂分别在上海、北京、苏州和广州等地运营。我们在全国还设立了8个应用开发中心以及示范实验室，将世界级的前沿技术和产品带给中国客户，并提供应用开发与培训等多项服务；拥位于上海的中国创新中心，拥有有100多位专业研究人员和工程师及70多项专利。创新中心专注于针对垂直市场的产品研究和开发，结合中国市场的需求和国外先进技术，研发适合中国的技术和产品；我们拥有遍布全国的维修服务网点和特别成立的中国技术培训团队，在全国有超过2600名专业人员直接为客户提供服务。我们致力于帮助客户使世界更健康、更清洁、更安全。
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科学仪器
Helios 5 Laser PFIB System
FIB SEM laser tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution
The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.
Key Features
Fast material removal
Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.
Accurate and repeatable cut placement
The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.
High throughput processing of challenging materials
Includes non-conductive or ion-beam-sensitive samples.
Shares all capabilities of the Helios 5 PFIB platform
High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.
Statistically relevant subsurface and 3D data analysis
Acquire data for much larger volumes within a shorter amount of time.
Fast characterization of deep subsurface features
Extraction of subsurface TEM lamella or chunks for 3D analysis.
Fast and easy characterization of air-sensitive samples
No need to transfer samples between different instruments for imaging and cross-sectioning.
Specifications
| Femtosecond-laser specifications | ||
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| Laser integration |
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| Laser Output | ||
| First Harmonic |
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1030 nm (IR) |
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<280 fs |
| Second Harmonic |
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515 nm (green) |
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<300 fs |
| Optics |
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| Coincident point |
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| Objective lens |
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| Polarization |
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| Repetition rate |
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| Position accuracy |
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| Protective shutter |
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| Software |
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